Based on 182mm wafer, N-type HJT half-cut cells
Module power up to 590W; module efficiency up to 22.80%
Use super MBB half-cut cell technology to minimize micro-crack impacts, so no cutting loss on modules
Power output from the front is 4.1% more than that of TOPCon module, and power output from the back is 14.76% more than that of TOPCon module
No Boron-Oxygen-Induced Degradation (BO-LID), excellent anti-LeTID & anti-PID performance. Low power degradation, and high energy yield
With the temperature coefficient -0.243%/℃
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